Invention Grant
- Patent Title: Light receiving element, optical communication device, and method for manufacturing a light receiving element
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Application No.: US16301363Application Date: 2017-02-21
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Publication No.: US10937919B2Publication Date: 2021-03-02
- Inventor: Yuji Masui , Shingo Kaneko
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JPJP2016-097799 20160516
- International Application: PCT/JP2017/006257 WO 20170221
- International Announcement: WO2017/199501 WO 20171123
- Main IPC: H01L31/105
- IPC: H01L31/105 ; H01L31/0232 ; H01L31/18 ; H01L31/14 ; H01L31/0304 ; H01L31/0352 ; H01L31/103 ; H01L31/0224 ; H01L31/173

Abstract:
A light receiving element (1) according to an embodiment of the disclosure includes a semiconductor layer (20) in which a photodiode having a PIN structure is provided in a mesa portion having a pillar shape. The photodiode includes a first conductive layer (21), an optical absorption layer (23), and a second conductive layer (24) having a light incident surface. In the light receiving element (1), the semiconductor layer (20) includes, in the vicinity of an interface between the first conductive layer (21) and the optical absorption layer (23), a constricted portion (26) that is the most constricted of the first conductive layer (21). The interface has an end exposed on an internal surface of the constricted portion (26).
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Information query
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