Invention Grant
- Patent Title: Semiconductor unit, semiconductor device, light-emitting apparatus, display apparatus, and method of manufacturing semiconductor device
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Application No.: US15128277Application Date: 2015-03-02
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Publication No.: US10937929B2Publication Date: 2021-03-02
- Inventor: Akira Ohmae , Yusuke Kataoka , Tatsuo Ohashi , Ippei Nishinaka , Goshi Biwa
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JPJP2014-071492 20140331
- International Application: PCT/JP2015/001082 WO 20150302
- International Announcement: WO2015/151401 WO 20151008
- Main IPC: H01L33/40
- IPC: H01L33/40 ; H01L33/62 ; F21V23/00 ; G06F3/147 ; H01L25/075 ; H01L33/30 ; H01L33/32
Abstract:
[Solving Means] A semiconductor unit includes a substrate, a semiconductor device, and a plating layer. The semiconductor device includes a semiconductor layer and one or more electrodes, the one or more electrodes being connected to the semiconductor layer and including a platinum-group element as a main material. The plating layer bonds the substrate and the electrode.
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Information query
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