Invention Grant
- Patent Title: Combiner and antenna apparatus
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Application No.: US16394789Application Date: 2019-04-25
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Publication No.: US10938080B2Publication Date: 2021-03-02
- Inventor: Jianwei Cao , Jianhua Wu
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: CN201621165028.1 20161025
- Main IPC: H01P1/20
- IPC: H01P1/20 ; H01P5/16 ; H05K1/02 ; H05K7/14 ; H01P7/04 ; H01Q1/50

Abstract:
A combiner is provided and belongs to the communications field. The combiner includes a conductive housing, a printed circuit board PCB, a conductive column, and a first conductor. The PCB, the conductive column, and the first conductor are located inside the conductive housing; one end of the conductive column is fastened to a bottom part of the conductive housing, the PCB is fastened to a top part of the conductive housing, and the first conductor is fastened to the PCB; and an axial direction of the first conductor is parallel to an axial direction of the conductive column, and a partial region of a side surface of the first conductor is opposite to the conductive column.
Public/Granted literature
- US20190252747A1 COMBINER AND ANTENNA APPARATUS Public/Granted day:2019-08-15
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