- Patent Title: Superconducting interconnects with ultra-low thermal conductivity
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Application No.: US16865040Application Date: 2020-05-01
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Publication No.: US10938128B2Publication Date: 2021-03-02
- Inventor: Vyacheslav Solovyov
- Applicant: Brookhaven Technology Group, Inc.
- Applicant Address: US NY Stony Brook
- Assignee: Brookhaven Technology Group, Inc.
- Current Assignee: Brookhaven Technology Group, Inc.
- Current Assignee Address: US NY Stony Brook
- Agency: Schroeder Law PC
- Main IPC: H01R4/68
- IPC: H01R4/68 ; H05K9/00 ; H01L39/12 ; H02G15/34
Abstract:
Superconducting interconnects with ultra-low thermal conductivity capable of providing a direct connection between a millikelvin temperature environment and a 70 K temperature environment.
Public/Granted literature
- US20200350709A1 Superconducting Interconnects with Ultra-Low Thermal Conductivity Public/Granted day:2020-11-05
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