Invention Grant
- Patent Title: High frequency optimized connector
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Application No.: US16410966Application Date: 2019-05-13
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Publication No.: US10938133B2Publication Date: 2021-03-02
- Inventor: Yi-Fang Chuang , Nai-Chien Chang
- Applicant: NICECONN TECHNOLOGY CO., LTD. , Yi-Fang Chuang , Nai-Chien Chang
- Applicant Address: TW New Taipei; TW New Taipei; TW New Taipei
- Assignee: NICECONN TECHNOLOGY CO., LTD.,Yi-Fang Chuang,Nai-Chien Chang
- Current Assignee: NICECONN TECHNOLOGY CO., LTD.,Yi-Fang Chuang,Nai-Chien Chang
- Current Assignee Address: TW New Taipei; TW New Taipei; TW New Taipei
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Priority: TW107116685 20180516
- Main IPC: H01R13/648
- IPC: H01R13/648 ; H01R4/58 ; H01R12/58 ; H01R12/71 ; H01R13/6471 ; H01R13/03 ; H01R13/646

Abstract:
A high frequency optimized connector including a circuit board having a top surface and a bottom surface is disclosed. A first golden finger set is placed on the top surface. A second golden finger set is placed on the bottom surface. The first golden finger set includes multiple data golden fingers and multiple auxiliary golden fingers. One end of each data golden finger is placed on a front section of the top surface, while the other end is connected from the front section of the top surface to the bottom surface through multiple middle through holes. One end of each auxiliary golden finger is placed on the front section, while the other end is extended to a rear section of the top surface through multiple first extension lines and is connected from the rear section to the bottom surface through multiple terminal through holes on the circuit board.
Public/Granted literature
- US20190356069A1 HIGH FREQUENCY OPTIMIZED CONNECTOR Public/Granted day:2019-11-21
Information query