Invention Grant
- Patent Title: Device housing for an electrical device
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Application No.: US16609926Application Date: 2018-05-03
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Publication No.: US10938146B2Publication Date: 2021-03-02
- Inventor: Severin Wattenhofer , Hideki Ito , Felix Schilter
- Applicant: Siemens Schweiz AG
- Applicant Address: CH Zürich
- Assignee: Siemens Schweiz AG
- Current Assignee: Siemens Schweiz AG
- Current Assignee Address: CH Zürich
- Agency: Slayden Grubert Beard PLLC
- Priority: EP17169737 20170505
- International Application: PCT/EP2018/061240 WO 20180503
- International Announcement: WO2018/202735 WO 20181108
- Main IPC: H01R13/58
- IPC: H01R13/58 ; H02G3/14 ; H02G15/007 ; H02G3/08

Abstract:
Various embodiments include device housing for an electrical device comprising: an inner housing with a first lower shell and a first upper shell; and an outer housing with a second lower shell and a second upper shell. There is a cable insertion opening defined by a cable seating profile in the first lower shell and a flush cable cover profile in the first upper shell for a cable routed to the device; a clamping body retained by the inner housing; and a friction and/or form-fitting contact between the clamping body and the cable can be effected by means of the outer housing when the clamping body is pressed onto an outer surface of the cable by the upper shell of the outer housing.
Public/Granted literature
- US20200220300A1 Device Housing for an Electrical Device Public/Granted day:2020-07-09
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