Invention Grant
- Patent Title: Electromagnetic interference (EMI) grounding protection method for a connector using a multi-directional conductive housing
-
Application No.: US16504287Application Date: 2019-07-07
-
Publication No.: US10938163B2Publication Date: 2021-03-02
- Inventor: Vikas Azad
- Applicant: J.S.T. CORPORATION
- Applicant Address: US MI Farmington Hills
- Assignee: J.S.T. CORPORATION
- Current Assignee: J.S.T. CORPORATION
- Current Assignee Address: US MI Farmington Hills
- Agency: Kratz, Quintos & Hanson, LLP
- Main IPC: H01R13/6599
- IPC: H01R13/6599 ; B60R16/03 ; H01R13/502 ; H01R13/6581 ; H01R13/6596 ; H01R13/74 ; H01R13/426 ; H01R13/436 ; H01R13/52 ; H01R13/53 ; H01R13/73 ; H01R43/20 ; H01R13/533 ; H01R13/6598

Abstract:
An electromagnetic interference (EMI) grounding protection method for a connector assembly using a multi-directional conductive housing. The method includes the steps of: conducting the EMI generated by a source towards a metallic braided shield, the metallic braided shield being secured and mounted onto the multi-directional conductive housing by a metallic clamp; conducting the EMI from the metallic braided shield to the metallic clamp and to the multi-directional conductive housing, the multi-directional conductive housing being mounted onto a metallic device by at least a metallic bolt and the bolt being accommodated within a corresponding metallic compression limiter; and thereafter, conducting the EMI: (1) from the metallic braided shield to the multi-directional conductive housing through the metallic compression limiters and through their respective bolts, and ultimately to the metallic device, and (2) from the metallic braided shield to the multi-directional conductive housing directly through conductive pads thereof, and ultimately to the metallic device.
Public/Granted literature
Information query