A double submodule for a modular multilevel converter comprising a first and second submodule coupled to the first. Each submodule comprises an asymmetric H bridge circuit with two parallel bridges branches, connected between a first and a second direct voltage node of the submodule. Each bridge branch is formed by a series connection from a controllable power semiconductor switch and a diode. A storage capacitor is connected in parallel to the asymmetric H bridge circuit between the first and the second direct voltage node of the submodule. The first and the second submodule are interconnected in such a way that a power semiconductor switch or a diode is part of a bridge branch of the first submodule as well as part of a bridge branch of the second submodule. A modular multilevel converter, comprises a series connection of such double submodules in each of its converter branches, is also disclosed.