Invention Grant
- Patent Title: Housing assembly
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Application No.: US16687632Application Date: 2019-11-18
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Publication No.: US10939568B2Publication Date: 2021-03-02
- Inventor: Yi-Sing Jiang
- Applicant: Chicony Electronics Co., Ltd.
- Applicant Address: TW New Taipei
- Assignee: Chicony Electronics Co., Ltd.
- Current Assignee: Chicony Electronics Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: CKC & Partners Co., LLC
- Priority: TW108125308 20190717
- Main IPC: H05K5/02
- IPC: H05K5/02 ; G08B13/196 ; H04N5/225 ; G06F1/16 ; H05K5/00

Abstract:
A housing assembly includes a main body, a button, a base, and a fixing member. The main body has an inner space and a through hole communicated with each other. The button includes a pressing portion. The pressing portion protrudes out of the main body from the through hole and is configured to be pressed to sink into the through hole. The base has a recess and an engaging hole communicated with each other. The recess is configured to accommodate the main body. The engaging hole is configured to be engaged with the pressing portion. The fixing member is coupled to the main body in the inner space and configured to block the pressing portion from sinking into the through hole and disengaging from the engaging hole.
Public/Granted literature
- US20210021737A1 HOUSING ASSEMBLY Public/Granted day:2021-01-21
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