Invention Grant
- Patent Title: Circuit board assembly
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Application No.: US16812814Application Date: 2020-03-09
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Publication No.: US10939572B2Publication Date: 2021-03-02
- Inventor: Ryan C. McDaniel , Stephen E. Strickland , Brian D. Kennedy
- Applicant: EMC IP Holding Company, LLC
- Applicant Address: US MA Hopkinton
- Assignee: EMC IP Holding Company, LLC
- Current Assignee: EMC IP Holding Company, LLC
- Current Assignee Address: US MA Hopkinton
- Agency: Holland & Knight LLP
- Agent Brian J. Colandreo; Mark H. Whittenberger
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/14 ; H05K1/14 ; H05K3/46 ; H05K3/36 ; H05K1/11 ; H05K1/02
Abstract:
A mid-plane assembly includes a main circuit board portion including a plurality of electrical connectors configured to releasably engage a plurality of devices, a first circuit board portion, and a first electrical coupling assembly configured to electrically couple the first circuit board portion to the main circuit board portion and position the first circuit board portion essentially orthogonal to the main circuit board portion.
Public/Granted literature
- US20200214162A1 CIRCUIT BOARD ASSEMBLY Public/Granted day:2020-07-02
Information query
