Invention Grant
- Patent Title: Structural panel, a structural system and a method of forming a structural panel
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Application No.: US15097557Application Date: 2016-04-13
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Publication No.: US10940665B2Publication Date: 2021-03-09
- Inventor: Ki Leuk Joseph Lai
- Applicant: City University of Hong Kong
- Applicant Address: HK Kowloon
- Assignee: City University of Hong Kong
- Current Assignee: City University of Hong Kong
- Current Assignee Address: HK Kowloon
- Agency: Renner Kenner Greive Bobak Taylor & Weber
- Main IPC: B32B3/20
- IPC: B32B3/20 ; B32B7/14 ; E01C5/16 ; B32B15/04 ; B32B15/18 ; B32B15/20 ; B64C1/06 ; B32B7/12 ; B32B15/01 ; B64C1/12 ; E01C5/00 ; E04C2/34 ; B64C1/00 ; E04C2/00
Abstract:
A system and method of a structural panel includes a first outer sheet and a second outer sheet, the first outer sheet and second outer sheet including a polygon shape; a core arrangement sandwiched between the first outer sheet and the second outer sheet, the core arrangement comprising two or more discrete members arranged adjacent each other, the discrete members shaped or structured to reduce crack initiation and propagation within the core arrangement.
Public/Granted literature
- US20170297291A1 STRUCTURAL PANEL, A STRUCTURAL SYSTEM AND A METHOD OF FORMING A STRUCTURAL PANEL Public/Granted day:2017-10-19
Information query
