Invention Grant
- Patent Title: Heat pump system
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Application No.: US15744598Application Date: 2016-10-27
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Publication No.: US10940740B2Publication Date: 2021-03-09
- Inventor: Kengo Sugimura , Yoshiki Katoh , Masayuki Takeuchi , Koji Miura , Norihiko Enomoto , Keigo Satou , Ariel Marasigan , Nobuyuki Hashimura
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JPJP2015-213162 20151029,JPJP2016-168059 20160830
- International Application: PCT/JP2016/081821 WO 20161027
- International Announcement: WO2017/073645 WO 20170504
- Main IPC: B60H1/08
- IPC: B60H1/08 ; B60H1/22 ; B60H1/00 ; F01P7/16 ; F01P3/20 ; B60H1/32

Abstract:
In a heat pump system, when a heat-shock determination portion determines that a difference between a coolant temperature in a coolant flow path and a coolant temperature in a heat source flow path is equal to or higher than a predetermined temperature, a flow-path switching portion mixes the respective coolants flowing through at least a bypass flow path and the heat source flow path together to flow into the coolant flow path.
Public/Granted literature
- US20180208019A1 HEAT PUMP SYSTEM Public/Granted day:2018-07-26
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