Invention Grant
- Patent Title: Heat-expandable microspheres and application thereof
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Application No.: US15575125Application Date: 2016-05-18
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Publication No.: US10941267B2Publication Date: 2021-03-09
- Inventor: Sachiko Tokumura , Yu Kita
- Applicant: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- Applicant Address: JP Yao
- Assignee: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- Current Assignee: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- Current Assignee Address: JP Yao
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2015-107415 20150527
- International Application: PCT/JP2016/064690 WO 20160518
- International Announcement: WO2016/190178 WO 20161201
- Main IPC: C08J9/32
- IPC: C08J9/32 ; C08F2/44 ; C08F220/06 ; B01J13/14 ; C08J9/228 ; C08L33/18

Abstract:
Heat-expandable microspheres and applications thereof, the heat-expandable microspheres including a thermoplastic resin shell and a thermally-vaporizable blowing agent encapsulated therein. The thermoplastic resin is produced by polymerizing a polymerizable component containing (A) a nitrile monomer including methacrylonitrile, (B) a carboxyl-group-containing monomer and (C) a monomer having a functional group reactive with the carboxyl group. The polymerizable component satisfies the following conditions 1 and 2:
Condition 1: The weight fraction of the monomers (A), (B) and (C) in the polymerizable component satisfy the inequality shown below. Weight fraction of the monomer (C)
Condition 1: The weight fraction of the monomers (A), (B) and (C) in the polymerizable component satisfy the inequality shown below. Weight fraction of the monomer (C)
Public/Granted literature
- US20180142076A1 HEAT-EXPANDABLE MICROSPHERES AND APPLICATION THEREOF Public/Granted day:2018-05-24
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