Invention Grant
- Patent Title: Surface treatment method, surface treatment agent, and method for forming film region-selectively on substrate
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Application No.: US16229854Application Date: 2018-12-21
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Publication No.: US10941301B2Publication Date: 2021-03-09
- Inventor: Kenji Seki
- Applicant: TOKYO OHKA KOGYO CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JPJP2017-254944 20171228,JPJP2018-125174 20180629
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/8234 ; H01L27/088 ; H01L29/66 ; H01L21/02 ; H01L21/762 ; C09D5/00 ; C23C16/455 ; C23C16/02 ; H01L21/3205 ; H01L21/321 ; C23C16/04 ; H01L21/3105 ; H01L21/32
Abstract:
A surface treatment method for a substrate surface; a surface treatment agent used for the surface treatment method; and a method for forming a film on a substrate in a region-selective manner. The method includes exposing the surface to a surface treatment agent including a silylation agent and a nitrogen-containing heterocyclic compound, the surface including two or more regions, adjacent regions in the two or more regions having different materials, and a reaction between the silylation agent and the two or more regions causing contact angles of water to differ from each other with respect to adjacent regions in the two or more regions.
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