Invention Grant
- Patent Title: Adhesive composition, and coverlay film, flexible copper clad laminate, and adhesive sheet using adhesive composition
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Application No.: US16314713Application Date: 2017-07-03
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Publication No.: US10941324B2Publication Date: 2021-03-09
- Inventor: Makoto Hirakawa , Masashi Yamada , Anna Sekioka
- Applicant: TOAGOSEI CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TOAGOSEI CO., LTD.
- Current Assignee: TOAGOSEI CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, LLP
- Priority: JPJP2016-132317 20160704
- International Application: PCT/JP2017/024329 WO 20170703
- International Announcement: WO2018/008592 WO 20180111
- Main IPC: C09J177/00
- IPC: C09J177/00 ; B32B15/08 ; B32B15/20 ; C09J11/06 ; C09J163/00 ; B32B27/20 ; H05K1/03 ; B32B27/00 ; C09J177/06 ; H05K3/28 ; C09J177/08 ; B32B27/38 ; B32B27/34 ; C09J11/04 ; C08K5/544
Abstract:
An adhesive composition is provided which exhibits not only adhesiveness to a polyimide film or copper foil, but also high adhesiveness to gold-plated copper foil, and is also superior in heat resistance such as soldering heat resistance.
The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25° C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the component (B) is 99/1-50/50, and the content of the component (C) is 0.3-5 parts by mass with respect to 100 parts by mass of the total of the component (A) and the component (B).
The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25° C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the component (B) is 99/1-50/50, and the content of the component (C) is 0.3-5 parts by mass with respect to 100 parts by mass of the total of the component (A) and the component (B).
Public/Granted literature
Information query
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