An apparatus and method for die defect detection are disclosed. The apparatus includes: a light source unit (10) for emitting light of at least two wavelengths; a beam splitter (40) for receiving the light emitted by the light source unit (10) and splitting it into a first portion and a second portion, the first portion of the light reflected by a die (60) surface under inspection and thereby forming a detection beam; a reference unit (70) for receiving the second portion of the light and processing it into a reference beam; and a detection unit (90) for receiving the detection beam and the reference beam. The reference beam crosses the detection beam at an angle and thus produces interference fringes on a sensing surface of the detection unit (90), based on which a defect parameter of the die (60) surface under inspection is determined. This apparatus is capable of measuring a die with improved accuracy and efficiency and is suitable for the measurement of large dies.