Invention Grant
- Patent Title: Load board and electronic component testing apparatus
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Application No.: US16351363Application Date: 2019-03-12
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Publication No.: US10942218B2Publication Date: 2021-03-09
- Inventor: Takashi Hashimoto , Keishi Oku , Hiroaki Takeuchi , Takatoshi Yoshino
- Applicant: ADVANTEST Corporation
- Applicant Address: JP Tokyo
- Assignee: ADVANTEST Corporation
- Current Assignee: ADVANTEST Corporation
- Current Assignee Address: JP Tokyo
- Agency: Osha Bergman Watanabe & Burton LLP
- Priority: JPJP2018-140087 20180726
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G05D23/20
Abstract:
A load board to which a socket is mounted is electrically connected to a tester. The load board includes a first optical communication unit capable of transmitting and/or receiving signals by optical wireless communication with an electronic component handling apparatus that presses a DUT against the socket.
Public/Granted literature
- US20200033402A1 LOAD BOARD AND ELECTRONIC COMPONENT TESTING APPARATUS Public/Granted day:2020-01-30
Information query
