- Patent Title: Augmented three dimensional point collection of vertical structures
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Application No.: US16798670Application Date: 2020-02-24
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Publication No.: US10942276B2Publication Date: 2021-03-09
- Inventor: Stephen L. Schultz , David R. Nilosek , David S. Petterson , Timothy S. Harrington
- Applicant: Pictometry International Corp.
- Applicant Address: US NY Rochester
- Assignee: Pictometry International Corp.
- Current Assignee: Pictometry International Corp.
- Current Assignee Address: US NY Rochester
- Agency: Dunlap Codding, P.C.
- Main IPC: G01S17/89
- IPC: G01S17/89 ; G06T7/00 ; H04N13/10 ; G06T7/73 ; G06T7/13 ; G06T7/66 ; G01C11/04 ; G06K9/00 ; G06K9/46 ; G06T7/521 ; G01S7/48

Abstract:
Automated methods and systems are disclosed, including a method comprising: obtaining a first three-dimensional-data point cloud of a horizontal surface of an object of interest, the first three-dimensional-data point cloud having a first resolution and having a three-dimensional location associated with each point in the first three-dimensional-data point cloud; capturing one or more aerial image, at one or more oblique angle, depicting at least a vertical surface of the object of interest; analyzing the one or more aerial image with a computer system to determine three-dimensional locations of additional points on the object of interest; and updating the first three-dimensional-data point cloud with the three-dimensional locations of the additional points on the object of interest to create a second three-dimensional-data point cloud having a second resolution greater than the first resolution of the first three-dimensional-data point cloud.
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