Invention Grant
- Patent Title: Fast multi-width instruction issue in parallel slice processor
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Application No.: US16141285Application Date: 2018-09-25
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Publication No.: US10942745B2Publication Date: 2021-03-09
- Inventor: Salma Ayub , Jeffrey C. Brownscheidle , Sundeep Chadha , Dung Q. Nguyen , Tu-An T. Nguyen , Salim A. Shah , Brian W. Thompto
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Mark Bergner
- Main IPC: G06F9/38
- IPC: G06F9/38

Abstract:
Fast issuance and execution of a multi-width instruction across multiple slices in a parallel slice processor core is supported in part through the use of an early notification signal passed between issue logic associated with multiple slices handling that multi-width instruction coupled with an issuance of a different instruction by the originating issue logic for the early notification signal.
Public/Granted literature
- US20190026113A1 FAST MULTI-WIDTH INSTRUCTION ISSUE IN PARALLEL SLICE PROCESSOR Public/Granted day:2019-01-24
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