Invention Grant
- Patent Title: Coil component
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Application No.: US16877944Application Date: 2020-05-19
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Publication No.: US10943719B2Publication Date: 2021-03-09
- Inventor: Miyuki Asai , Hokuto Eda , Masazumi Arata , Hitoshi Ohkubo
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2019-095127 20190521
- Main IPC: H01F5/06
- IPC: H01F5/06 ; H01F17/00

Abstract:
In a coil component, an insulation layer covers an upper surface of a conductor pattern. Accordingly, insulating properties between the conductor pattern and a magnetic body are enhanced, and insulating properties between the conductor patterns are enhanced. In addition, in the coil component, the magnetic body enters a space between resin walls such that the insulation layer is covered. Therefore, a volume of the magnetic body above the conductor pattern is increased, and high coil characteristics are realized.
Public/Granted literature
- US20200373050A1 COIL COMPONENT Public/Granted day:2020-11-26
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