Invention Grant
- Patent Title: Relay cooling device
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Application No.: US15772434Application Date: 2016-11-10
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Publication No.: US10943752B2Publication Date: 2021-03-09
- Inventor: Hiroomi Hiramitsu , Tomotaka Kurozu
- Applicant: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Yokkaichi; JP Yokkaichi; JP Osaka
- Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Yokkaichi; JP Yokkaichi; JP Osaka
- Agency: Reising Ethington, P.C.
- Priority: JPJP2015-220343 20151110
- International Application: PCT/JP2016/083320 WO 20161110
- International Announcement: WO2017/082331 WO 20170518
- Main IPC: H01H50/12
- IPC: H01H50/12 ; H01H45/12 ; H05K7/20
Abstract:
A relay cooling device includes a container, a liquid coolant that is stored in the container, and a relay that is immersed in the liquid coolant.
Public/Granted literature
- US20180330906A1 RELAY COOLING DEVICE Public/Granted day:2018-11-15
Information query
