Invention Grant
- Patent Title: Method for arranging a plurality of seed substrates on a carrier element and carrier element having seed substrates
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Application No.: US16335911Application Date: 2017-08-24
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Publication No.: US10943826B2Publication Date: 2021-03-09
- Inventor: Stefan Reber , Kai Schillinger
- Applicant: NexWafe GmbH
- Applicant Address: DE Freiburg
- Assignee: NexWafe GmbH
- Current Assignee: NexWafe GmbH
- Current Assignee Address: DE Freiburg
- Agency: Volpe Koenig
- Priority: DE102016117912.4 20160922
- International Application: PCT/EP2017/071368 WO 20170824
- International Announcement: WO2018/054651 WO 20180329
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/02 ; H01L31/18 ; C25F3/12
Abstract:
A method for arranging a plurality of semiconductor seed substrates on a carrier element, in which for applying a semiconductor layer to the seed substrates, the seed substrates are arranged on the carrier element by integral bonding. A carrier element having integrally bonded seed substrates for coating with a semiconductor layer is also provided.
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