Invention Grant
- Patent Title: Piezoelectric MEMS-based active cooling for heat dissipation in compute devices
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Application No.: US16369766Application Date: 2019-03-29
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Publication No.: US10943850B2Publication Date: 2021-03-09
- Inventor: Suryaprakash Ganti , Seshagiri Rao Madhavapeddy
- Applicant: Frore Systems Inc.
- Applicant Address: US CA Los Altos
- Assignee: Frore Systems Inc.
- Current Assignee: Frore Systems Inc.
- Current Assignee Address: US CA Los Altos
- Agency: Van Pelt, Yi & James LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/473 ; F04B53/10 ; F04B43/04 ; F04B45/047 ; B06B1/06 ; H01L23/427 ; H01L23/433 ; H01L41/09 ; F25B21/02 ; F04D33/00 ; H04M1/02 ; H01L41/02 ; H01L41/00 ; F04B43/09 ; H01L23/46 ; H01L23/42 ; F04B17/00 ; F04B45/04 ; H01L41/08

Abstract:
An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.
Public/Granted literature
- US20200051895A1 PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COMPUTE DEVICES Public/Granted day:2020-02-13
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