Invention Grant
- Patent Title: Semiconductor package and semiconductor apparatus for use with high-frequency signals and improved heat dissipation
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Application No.: US16463565Application Date: 2017-10-12
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Publication No.: US10943854B2Publication Date: 2021-03-09
- Inventor: Michikazu Nagata , Shoujirou Kizu , Shinya Tomida
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Volpe Koenig
- Priority: JPJP2016-230125 20161128
- International Application: PCT/JP2017/036965 WO 20171012
- International Announcement: WO2018/096826 WO 20180531
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/36 ; H01L23/12 ; H01L23/13 ; H01L23/373 ; H01L23/00 ; H01L23/04 ; H01L23/047 ; H01L23/52
Abstract:
A semiconductor package includes a metal board, a first frame, and a second frame. The metal board has an upper surface with a mount area on which a semiconductor device is mountable. The first frame is located on the upper surface of the metal board to surround the mount area. The second frame is located on a bottom surface of the metal board to overlap the first frame. The metal board includes a protrusion protruding from its bottom surface. The protrusion has side surfaces in contact with inner walls of the second frame. The protrusion has a bottom surface located below the second frame.
Public/Granted literature
- US20190279923A1 SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR APPARATUS Public/Granted day:2019-09-12
Information query
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