Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16527543Application Date: 2019-07-31
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Publication No.: US10943859B2Publication Date: 2021-03-09
- Inventor: Eiji Hayashi , Ryoji Uwataki , Tomomi Okumura
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JPJP2017-056316 20170322,JPJP2017-117217 20170614
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/56 ; H01L23/12 ; H01L23/28 ; H01L23/40 ; H01L23/495 ; H01L23/00
Abstract:
The present disclosure describes a semiconductor device including: a semiconductor chip having an electrode; a conductive member including a metal base and having a mounting portion and a peripheral portion surrounding the mounting portion; a solder that is provided between the electrode and the mounting portion; and a sealing resin body that integrally seals the semiconductor chip, at least the face opposed to the electrode in the conductive member, and the solder.
Public/Granted literature
- US20190355656A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-11-21
Information query
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