Invention Grant
- Patent Title: Apparatus, system, and method for mitigating warpage of integrated circuits during reflow processes
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Application No.: US16555773Application Date: 2019-08-29
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Publication No.: US10943874B1Publication Date: 2021-03-09
- Inventor: Peng Su , Valery Kugel , Jimmy Chun-Chuen Leung
- Applicant: Juniper Networks, Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Juniper Networks, Inc.
- Current Assignee: Juniper Networks, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: FisherBroyles, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/10 ; H01L23/16 ; H01L21/50
Abstract:
The stiffening brace may include a set of borders dimensioned to substantially surround an integrated circuit, wherein each border includes (1) a portion of material that is positioned atop a perimeter of the integrated circuit and (2) an additional portion of material that extends beyond the perimeter of the integrated circuit such that the additional portion of material overhangs a circuit board to which the integrated circuit is soldered. Various other apparatuses, systems, and methods are also disclosed.
Information query
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