Invention Grant
- Patent Title: Fragmenting computer chips
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Application No.: US16354286Application Date: 2019-03-15
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Publication No.: US10943875B2Publication Date: 2021-03-09
- Inventor: Cyril Cabral, Jr. , Kenneth P. Rodbell
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Alexander G. Jochym
- Main IPC: H01L23/00
- IPC: H01L23/00 ; C06B45/10 ; H01L23/58 ; H05K1/18 ; C06B43/00 ; C06B45/14 ; H01L27/24
Abstract:
A method comprising bonding a first substrate to a second substrate. The first substrate includes a layer of one or more pairs of reactive material. The method comprising triggering a reaction between the one or more pairs of reactive material and fragmenting the second substrate.
Public/Granted literature
- US20190214351A1 FRAGMENTING COMPUTER CHIPS Public/Granted day:2019-07-11
Information query
IPC分类:
