Invention Grant
- Patent Title: Application placing and scaling
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Application No.: US16447475Application Date: 2019-06-20
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Publication No.: US10944816B2Publication Date: 2021-03-09
- Inventor: Dinakar Guniguntala , Deepthi Sebastian , Sudip Karmakar , Kabir Islam , Suman Mitra
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Heslin Rothenberg Farley & Mesiti P.C.
- Agent Christopher Pignato, Esq.; George Blasiak, Esq.
- Main IPC: H04L29/08
- IPC: H04L29/08 ; H04L12/26 ; H04L12/24

Abstract:
Methods, computer program products, and systems are presented. The method computer program products, and systems can include, for instance: obtaining from a plurality of computing environments computing environment characterizing data; obtaining application parameter data defined by an application provider, the application parameter data specifying attributes of an application component group defining an application, wherein the application parameter data includes group membership specifying data that specifies that certain application components are to be deployed as a group in a common computing environment; determining, in dependence on data of the computing environment characterizing data and data of the application parameter data, a set of computing environments for deployment of the application component group, and a placement ratio for the application component group.
Information query