Invention Grant
- Patent Title: Thermal-curable adhesive composition and adhesive sheet
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Application No.: US15719624Application Date: 2017-09-29
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Publication No.: US10947417B2Publication Date: 2021-03-16
- Inventor: Chih-Wei Lin , Chun-Ting Lai
- Applicant: TAIMIDE TECH. INC.
- Applicant Address: TW Hsinchu
- Assignee: TAIMIDE TECH. INC.
- Current Assignee: TAIMIDE TECH. INC.
- Current Assignee Address: TW Hsinchu
- Agency: Li & Cai Intellectual Property (USA) Office
- Main IPC: C09J4/06
- IPC: C09J4/06 ; C09J7/02 ; B32B7/12 ; C09J7/29 ; C09J7/30 ; C08F265/06

Abstract:
The instant disclosure provides a thermal-curable adhesive composition and adhesive sheet. The thermal-curable adhesive composition has a rate of change of adhesion ranging from 80% to 98% and defined by the following equation: V=[(V0−V1)/V0]×100, wherein V is the rate of change of adhesion of the thermal-curable adhesive composition, V0 is the adhesion of the thermal-curable adhesive composition under room temperature, and V1 is the adhesion of the thermal-curable adhesive composition after being heated to a predetermined temperature then cooled to the room temperature.
Public/Granted literature
- US20190100679A1 THERMAL-CURABLE ADHESIVE COMPOSITION AND ADHESIVE SHEET Public/Granted day:2019-04-04
Information query
IPC分类: