Invention Grant
- Patent Title: Fracturing method for creating complex crack network by intermittent fracturing on site
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Application No.: US16257254Application Date: 2019-01-25
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Publication No.: US10947830B2Publication Date: 2021-03-16
- Inventor: Guangqing Zhang , Yuanxun Nie , Cankun Lin
- Applicant: China University of Petroleum—Beijing
- Applicant Address: CN Beijing
- Assignee: China University of Petroleum—Beijing
- Current Assignee: China University of Petroleum—Beijing
- Current Assignee Address: CN Beijing
- Agency: Young Basile Hanlon & MacFarlane, P.C.
- Priority: CN201810927321.4 20180815
- Main IPC: E21B43/26
- IPC: E21B43/26 ; E21B43/20 ; E21B47/18

Abstract:
A fracturing method for creating a complex crack network by intermittent fracturing on site, which relates to oil and gas field development, and comprises the following steps: pumping a fracturing fluid into an oil well to enter the reservoir, continuing pumping the fracturing fluid into fractured cracks after a pumping pressure has reached a preset pressure, and stopping pumping the fracturing fluid after a preset condition has been reached; performing under-pressure shut-in for the oil well; stopping the shut-in operation when a signal detecting vehicle cannot receive an obvious microseismic signal in the under-pressure shut-in process; repeating the above three steps multiple times; pumping the fracturing fluid into the oil well to enter the reservoir by the fracturing truck until an amount of the pumped in fracturing fluid reaches a design pump-in liquid amount; pumping a sand-carrying fluid into the oil well to enter the reservoir by means of a sand blending truck and the fracturing truck after the amount of the pumped in fracturing fluid has reached the design pump-in liquid amount, and stopping pumping the sand-carrying fluid after the pumped in sand-carrying fluid has reached a preset sand adding amount.
Public/Granted literature
- US20200056465A1 FRACTURING METHOD FOR CREATING COMPLEX CRACK NETWORK BY INTERMITTENT FRACTURING ON SITE Public/Granted day:2020-02-20
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