Invention Grant
- Patent Title: Laminate and pattern forming method
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Application No.: US15783397Application Date: 2017-10-13
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Publication No.: US10948823B2Publication Date: 2021-03-16
- Inventor: Satoshi Asai , Kyoko Soga , Hideto Kato
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JPJP2016-202352 20161014
- Main IPC: G03F7/075
- IPC: G03F7/075 ; G03F7/11 ; G03C11/12 ; C08G77/38 ; G03F7/038 ; G03F7/16 ; G03F7/20 ; C09D133/08 ; C09D133/24 ; C09D163/00 ; C09D167/00 ; C09D175/04 ; C09D183/04

Abstract:
To provide a laminate which enables pattern formation with excellent opening shape even in the case where a chemically amplified negative type resist material is used, and a pattern forming method in which the laminate is used.
The laminate includes a chemically amplified negative type resist layer, and a basic resin coat layer thereon that contains 0.001 to 10% by weight of a basic compound having a molecular weight of up to 10,000.
The laminate includes a chemically amplified negative type resist layer, and a basic resin coat layer thereon that contains 0.001 to 10% by weight of a basic compound having a molecular weight of up to 10,000.
Public/Granted literature
- US20180107116A1 LAMINATE AND PATTERN FORMING METHOD Public/Granted day:2018-04-19
Information query
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