Invention Grant
- Patent Title: Using interleaved writes to separate die planes
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Application No.: US16440233Application Date: 2019-06-13
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Publication No.: US10949123B2Publication Date: 2021-03-16
- Inventor: Liam Parker
- Applicant: Western Digital Technologies, Inc.
- Applicant Address: US CA San Jose
- Assignee: Western Digital Technologies, Inc.
- Current Assignee: Western Digital Technologies, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Patterson & Sheridan, LLP
- Agent Steven H. Versteeg
- Main IPC: G06F3/06
- IPC: G06F3/06 ; G06F12/0804 ; G06F11/10 ; G11C29/52 ; G06F12/02

Abstract:
In one embodiment, a solid state device includes a controller and a non-volatile memory. The non-volatile memory includes a plurality of dies. Each die includes a plurality of planes. A first super-plane-block is structured from a first plane of the plurality of dies. A second super-plane-block is structured from a second plane of the plurality of dies. A plurality of memory operation instructions that, when executed by the controller, cause the controller to receive a first data stream, write the first data stream to the first super-plane-block, receive a second data stream, and write the second data stream to the second super-plane-block.
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