Invention Grant
- Patent Title: Manufacturing method of semiconductor device
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Application No.: US16660836Application Date: 2019-10-23
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Publication No.: US10950446B2Publication Date: 2021-03-16
- Inventor: Hiroshi Takishita , Takashi Yoshimura , Takahiro Tamura , Yuichi Onozawa , Akio Yamano
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP2015-183143 20150916
- Main IPC: H01L21/265
- IPC: H01L21/265 ; H01L29/861 ; H01L21/263 ; H01L29/32 ; H01L29/739 ; H01L29/36 ; H01L21/8222 ; H01L27/06

Abstract:
Provided is a semiconductor device including: a semiconductor substrate doped with an impurity; a front-surface-side electrode provided at a side of a front surface of the semiconductor substrate; and a back-surface-side electrode provided at a side of a back surface of the semiconductor substrate; wherein the semiconductor substrate includes: a peak region arranged at the side of the back surface of the semiconductor substrate and having one or more peaks of an impurity concentration; a high concentration region arranged closer to the front surface than the peak region and having an impurity concentration more gently sloped than the one or more peaks; and a low concentration region arranged closer to the front surface than the high concentration region and having an impurity concentration lower than the impurity concentration of the high concentration region and a substrate concentration of the semiconductor substrate.
Public/Granted literature
- US20200051820A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2020-02-13
Information query
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