Invention Grant
- Patent Title: Microelectronic devices comprising manganese-containing conductive structures, and related electronic systems
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Application No.: US16856824Application Date: 2020-04-23
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Publication No.: US10950496B2Publication Date: 2021-03-16
- Inventor: Kentaro Ishii
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L23/532
- IPC: H01L23/532 ; H01L21/768
Abstract:
A microelectronic device comprises a first conductive material comprising copper, a conductive plug comprising tungsten in electrical communication with the first conductive material, and manganese particles dispersed along an interface between the first conductive material and the conductive plug. Related electronic systems and related methods are also disclosed.
Public/Granted literature
Information query
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