Invention Grant
- Patent Title: Lead-free column interconnect
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Application No.: US16358658Application Date: 2019-03-19
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Publication No.: US10950573B2Publication Date: 2021-03-16
- Inventor: Charles L. Arvin , Clement J. Fortin , Christopher D. Muzzy , Krishna R. Tunga , Thomas Weiss
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Law Offices of Ira D. Blecker, P.C.
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/532
Abstract:
Disclosed are interconnects in which one substrate having a high melting temperature, lead-free solder column is joined to a second substrate having openings filled with a low melting temperature, lead-free solder such that the high melting temperature, lead-free solder column penetrates into the low melting temperature, lead-free solder so as to obtain a short moment arm of solder.
Public/Granted literature
- US20200303339A1 LEAD-FREE COLUMN INTERCONNECT Public/Granted day:2020-09-24
Information query
IPC分类:
