Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16368814Application Date: 2019-03-28
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Publication No.: US10950611B2Publication Date: 2021-03-16
- Inventor: Wei Cheng Wu , Li-Feng Teng
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L27/11531
- IPC: H01L27/11531 ; H01L27/11517 ; H01L27/11526 ; H01L29/66 ; H01L21/28 ; H01L27/11536 ; H01L27/11539 ; H01L27/115 ; H01L27/11521 ; H01L27/11548 ; H01L27/11551 ; H01L29/423

Abstract:
A semiconductor device includes a non-volatile memory. The non-volatile memory includes a first dielectric layer disposed on a substrate, a floating gate disposed on the dielectric layer, a control gate. A second dielectric layer is disposed between the floating gate and the control gate, having one of a silicon nitride layer, a silicon oxide layer and multilayers thereof. A third dielectric layer is disposed between the second dielectric layer and the control gate, and includes a dielectric material having a dielectric constant higher than silicon nitride.
Public/Granted literature
- US20190229124A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-07-25
Information query
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