Invention Grant
- Patent Title: Silicon carbide semiconductor component
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Application No.: US16281257Application Date: 2019-02-21
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Publication No.: US10950696B2Publication Date: 2021-03-16
- Inventor: Thomas Basler , Hans-Joachim Schulze , Ralf Siemieniec
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102018103973 20180222
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L29/78 ; H01L29/06 ; H01L29/66 ; H01L29/167 ; H01L29/861 ; H01L29/872 ; H01L29/32 ; H01L29/08 ; H01L29/417

Abstract:
A semiconductor component includes a field effect transistor structure in a SiC semiconductor body having a gate structure at a first surface of the SiC semiconductor body and a drift zone of a first conductivity type. A zone of the first conductivity type is formed in a vertical direction between a semiconductor region of a second conductivity type and the drift zone. The zone is spaced apart from the gate structure and is at a maximal distance of 1 μm from the semiconductor region in the vertical direction.
Public/Granted literature
- US20190259842A1 Silicon Carbide Semiconductor Component Public/Granted day:2019-08-22
Information query
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