Invention Grant
- Patent Title: Vertical gate all-around transistor
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Application No.: US14588337Application Date: 2014-12-31
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Publication No.: US10950722B2Publication Date: 2021-03-16
- Inventor: John H. Zhang , Carl Radens , Lawrence A. Clevenger , Yiheng Xu
- Applicant: STMICROELECTRONICS, INC. , INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US TX Coppell; US NY Armonk
- Assignee: STMICROELECTRONICS, INC.,INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: STMICROELECTRONICS, INC.,INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US TX Coppell; US NY Armonk
- Agency: Seed IP Law Group LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/165 ; H01L27/092 ; H01L29/66 ; H01L21/8238

Abstract:
Vertical GAA FET structures are disclosed in which a current-carrying nanowire is oriented substantially perpendicular to the surface of a silicon substrate. The vertical GAA FET is intended to meet design and performance criteria for the 7 nm technology generation. In some embodiments, electrical contacts to the drain and gate terminals of the vertically oriented GAA FET can be made via the backside of the substrate. Examples are disclosed in which various n-type and p-type transistor designs have different contact configurations. In one example, a backside gate contact extends through the isolation region between adjacent devices. Other embodiments feature dual gate contacts for circuit design flexibility. The different contact configurations can be used to adjust metal pattern density.
Public/Granted literature
- US20160190312A1 VERTICAL GATE ALL-AROUND TRANSISTOR Public/Granted day:2016-06-30
Information query
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