Invention Grant
- Patent Title: Seamless listen-through for a wearable device
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Application No.: US16896010Application Date: 2020-06-08
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Publication No.: US10951975B2Publication Date: 2021-03-16
- Inventor: Lae-Hoon Kim , Dongmei Wang , Fatemeh Saki , Taher Shahbazi Mirzahasanloo , Erik Visser , Rogerio Guedes Alves
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Espartaco Diaz Hidalgo
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/10

Abstract:
Methods, systems, and devices for signal processing are described. Generally, in one example as provided for by the described techniques, a wearable device includes a processor configured to retrieve a plurality of external microphone signals that includes audio sound from outside of the device from a memory; to separate, based on at least information from an internal microphone signal, a self-voice component from a background component; to perform a first listen-through operation on the separated self-voice component to produce a first listen-through signal; and to produce an output audio signal that is based on at least the first listen-through signal, wherein the output audio signal includes an audio zoom signal that includes audio sound of the plurality of external microphone signals.
Public/Granted literature
- US20200304903A1 SEAMLESS LISTEN-THROUGH FOR A WEARABLE DEVICE Public/Granted day:2020-09-24
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