Invention Grant
- Patent Title: Removal of high stress zones in electronic assemblies
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Application No.: US16955288Application Date: 2018-12-03
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Publication No.: US10952314B2Publication Date: 2021-03-16
- Inventor: Philippe Chocteau , Denis Lecordier
- Applicant: SAFRAN ELECTRONICS & DEFENSE
- Applicant Address: FR Boulogne-Billancourt
- Assignee: SAFRAN ELECTRONICS & DEFENSE
- Current Assignee: SAFRAN ELECTRONICS & DEFENSE
- Current Assignee Address: FR Boulogne-Billancourt
- Agency: Sughrue Mion, PLLC
- Priority: FR1762467 20171219
- International Application: PCT/EP2018/083369 WO 20181203
- International Announcement: WO2019/120969 WO 20190627
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/02 ; H05K1/11 ; H05K3/30

Abstract:
The invention relates to an electronic board (1) comprising: —a printed circuit (2) having a connection face (3) defining a plane (X, Y) comprising at least one transfer area (4), —an electronic component (5) comprising at least one contact terminal (6), each contact terminal (6) being brazed or sintered on an associated transfer area (4) by means of a brazing joint or of a sintering joint (7), the electronic board being characterised in that an orthogonal projection of the contact terminal (6) of the electronic component (5) on the connection face (3) of the printed circuit does not overlap the associated area (4).
Information query