Removal of high stress zones in electronic assemblies
Abstract:
The invention relates to an electronic board (1) comprising: —a printed circuit (2) having a connection face (3) defining a plane (X, Y) comprising at least one transfer area (4), —an electronic component (5) comprising at least one contact terminal (6), each contact terminal (6) being brazed or sintered on an associated transfer area (4) by means of a brazing joint or of a sintering joint (7), the electronic board being characterised in that an orthogonal projection of the contact terminal (6) of the electronic component (5) on the connection face (3) of the printed circuit does not overlap the associated area (4).
Information query
Patent Agency Ranking
0/0