- Patent Title: Encoder scale, manufacturing method for encoder scale, and encoder
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Application No.: US16173023Application Date: 2018-10-29
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Publication No.: US10955265B2Publication Date: 2021-03-23
- Inventor: Akio Konishi
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JPJP2017-209385 20171030
- Main IPC: G01D5/34
- IPC: G01D5/34 ; G01D5/347 ; G01D5/353 ; G01D5/36

Abstract:
An encoder scale includes a tabular base material and an optical pattern provided above one surface of the base material, a first region and a second region being disposed side by side above the optical pattern. The first region includes a resin layer disposed above the base material and including photosensitive resin and a metal film disposed above the resin layer and formed of a metal material. The surface of the first region is configured mainly by a first surface having a normal line in the thickness direction of the base material. The surface of the second region is configured mainly by a second surface inclined with respect to the first surface.
Public/Granted literature
- US20190128706A1 ENCODER SCALE, MANUFACTURING METHOD FOR ENCODER SCALE, AND ENCODER Public/Granted day:2019-05-02
Information query
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