Invention Grant
- Patent Title: Sensor chip junction structure and pressure sensor
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Application No.: US16625397Application Date: 2018-06-20
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Publication No.: US10955305B2Publication Date: 2021-03-23
- Inventor: Kazuya Takimoto
- Applicant: SAGINOMIYA SEISAKUSHO, INC.
- Applicant Address: JP Tokyo
- Assignee: SAGINOMIYA SEISAKUSHO, INC.
- Current Assignee: SAGINOMIYA SEISAKUSHO, INC.
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JPJP2017-123085 20170623
- International Application: PCT/JP2018/023533 WO 20180620
- International Announcement: WO2018/235882 WO 20181227
- Main IPC: G01L9/00
- IPC: G01L9/00 ; G01L19/04

Abstract:
In a sensor chip junction structure, if a moving distance of a tip of a press jig (56) is any of 50 μm and 30 μm, for example, a characteristic line of a load (shearing force) (N) applied to an adhesive layer (50) formed on a sensor chip that is integral with a glass pedestal, the glass pedestal having a thickness set in a range from 0.3 mm to 2.5 mm is either located on any of a characteristic line Lt1 (y=1.3889x3) and a characteristic line Lt2 (y=0.463x3) or located in a region above zero and equal to or below any of the characteristic line Lt1 and the characteristic line Lt2.
Information query