Invention Grant
- Patent Title: Semiconductor device and method
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Application No.: US16567053Application Date: 2019-09-11
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Publication No.: US10957604B2Publication Date: 2021-03-23
- Inventor: Shih-Chieh Wu , Pang-Chi Wu , Kuo-Yi Chao , Mei-Yun Wang , Hsien-Huang Liao , Tung-Heng Hsieh , Bao-Ru Young
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/82
- IPC: H01L21/82 ; H01L21/76 ; H01L21/8234 ; H01L29/66 ; H01L21/768

Abstract:
In an embodiment, a method includes: forming a first fin extending from a substrate; forming a second fin extending from the substrate, the second fin being spaced apart from the first fin by a first distance; forming a metal gate stack over the first fin and the second fin; depositing a first inter-layer dielectric over the metal gate stack; and forming a gate contact extending through the first inter-layer dielectric to physically contact the metal gate stack, the gate contact being laterally disposed between the first fin and the second fin, the gate contact being spaced apart from the first fin by a second distance, where the second distance is less than a second predetermined threshold when the first distance is greater than or equal to a first predetermined threshold.
Information query
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