Invention Grant
- Patent Title: Semiconductor module and semiconductor device container
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Application No.: US16786487Application Date: 2020-02-10
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Publication No.: US10957613B2Publication Date: 2021-03-23
- Inventor: Tomoki Ohno
- Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Applicant Address: JP Kanagawa
- Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Current Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Current Assignee Address: JP Kanagawa
- Agency: Smith, Gambrell & Russell, LLP.
- Priority: JPJP2019-022410 20190212
- Main IPC: H01L23/13
- IPC: H01L23/13 ; H01L23/492 ; H01L23/495 ; H01L23/15 ; H01L23/14
Abstract:
A semiconductor module includes a base plate made of a metal, an insulating frame provided on a peripheral edge portion of the base plate, a lead made of a metal and provided on the frame, and a semiconductor device mounted on the base plate in a space surrounded by the frame, wherein the frame is fixed to the base plate by a bonding material containing silver, the frame has concave portions formed in an inner portion which is a corner portion on a space side and an outer portion which is a corner portion on a side opposite to the inner portion in a surface thereof which faces the base plate, and the concave portions are filled with a coating material.
Public/Granted literature
- US20200258796A1 SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE CONTAINER Public/Granted day:2020-08-13
Information query
IPC分类:
