Invention Grant
- Patent Title: Semiconductor packages including a bridge die
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Application No.: US16546748Application Date: 2019-08-21
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Publication No.: US10957627B2Publication Date: 2021-03-23
- Inventor: Bok Kyu Choi
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Agency: William Park & Associates Ltd.
- Priority: KR10-2019-0030148 20190315
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/31 ; H01L23/00 ; H01L23/522
Abstract:
A semiconductor package includes a semiconductor die and a bridge die. The bridge die is configured to include a through via formed in a body of the bridge die and a capacitor electrically coupled to the through via.
Public/Granted literature
- US20200294889A1 SEMICONDUCTOR PACKAGES INCLUDING A BRIDGE DIE Public/Granted day:2020-09-17
Information query
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