- Patent Title: Semiconductor device and semiconductor device manufacturing method
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Application No.: US16481971Application Date: 2018-12-19
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Publication No.: US10957630B2Publication Date: 2021-03-23
- Inventor: Soichiro Umeda , Atsushi Kyutoku
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Nixon & Vanderhye P.C.
- International Application: PCT/JP2018/046875 WO 20181219
- International Announcement: WO2020/129195 WO 20200625
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/49 ; H01L21/48 ; H01L21/56 ; H01L23/31 ; H01L23/373

Abstract:
A semiconductor device includes: a circuit unit including a semiconductor chip; a plurality of pin terminals formed in a rod shape extending in a same direction from the circuit unit and electrically connected to the circuit unit; a sealing resin portion sealing the circuit unit and first portions of the plurality of pin terminals positioned on a side of the circuit unit; and a plurality of covering resin portions integrally extending from an outer surface of the sealing resin portion from which second portions of the plurality of pin terminals protrude, the plurality of covering resin portions being formed in a cylindrical shape respectively covering base end portions of the second portions of the plurality of pin terminals, which are positioned on a side of the sealing resin portion.
Public/Granted literature
- US20200350236A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD Public/Granted day:2020-11-05
Information query
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