Invention Grant
- Patent Title: Semiconductor apparatus and module
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Application No.: US16494149Application Date: 2018-01-31
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Publication No.: US10957689B2Publication Date: 2021-03-23
- Inventor: Kenji Noguchi , Toshiyuki Koimori , Hiroaki Nagano , Masaya Uemura , Megumi Nakayama
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JP2017-055787 20170322
- International Application: PCT/JP2018/003252 WO 20180131
- International Announcement: WO2018/173497 WO 20180927
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L49/02

Abstract:
Provided is a semiconductor apparatus capable of enhancing the withstand voltage while suppressing the enlargement of the chip area. Provided is semiconductor apparatus including: a first terminal to which a high frequency signal is supplied; a second terminal from which the high frequency signal is output; first, second and third switch elements electrically connected in series between the first terminal and the second terminal; a first capacitor provided between the first terminal and a first node between the first switch element and the second switch element; and a second capacitor provided between the first terminal and a second node between the second switch element and the third switch element, in which the capacitance of the first capacitor is greater than the capacitance of the second capacitor.
Public/Granted literature
- US20200013772A1 SEMICONDUCTOR APPARATUS AND MODULE Public/Granted day:2020-01-09
Information query
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