Invention Grant
- Patent Title: Ultra-high frequency super thin coaxial RF connector assembly
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Application No.: US16522655Application Date: 2019-07-26
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Publication No.: US10958021B2Publication Date: 2021-03-23
- Inventor: Yi-Gen Lyu
- Applicant: HARUMOTO TECHNOLOGY (SHEN ZHEN) CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: HARUMOTO TECHNOLOGY (SHEN ZHEN) CO., LTD.
- Current Assignee: HARUMOTO TECHNOLOGY (SHEN ZHEN) CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Lanway IPR Services
- Agent Chun-Ming Shih
- Priority: CN201810846310 20180727
- Main IPC: H01R24/50
- IPC: H01R24/50 ; H01R24/52 ; H01R24/54

Abstract:
An ultra-high frequency super thin coaxial RF connector assembly comprising a combination of an ultra-high frequency super thin coaxial RF board side connector and an ultra-high frequency super thin coaxial RF wire side connector, wherein the arrangement of a traditionally conventional board side connector center terminal is omitted for the ultra-high frequency super thin coaxial RF board side connector, for the ultra-high frequency super thin coaxial RF wire side connector to transfer an RF signal to a circuit board directly without using an RF board side center terminal. As such, there is no need to arrange a board side center terminal in the Ultra high frequency super thin coaxial RF board side connector, so that a board side shield terminal in the Ultra high frequency super thin coaxial RF board side connector may provide an electrical shield more effectively, allowing the ultra-high frequency super thin coaxial RF connector assembly of the present invention to be capable of providing an RF signal in an UHF (Ultra High Frequency) millimeter wave band above 30 GHz for transmission.
Public/Granted literature
- US20200036143A1 Ultra-high Frequency Super Thin Coaxial RF Connector Assembly Public/Granted day:2020-01-30
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