Invention Grant
- Patent Title: Peeling device and method
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Application No.: US16084033Application Date: 2017-02-06
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Publication No.: US10958048B2Publication Date: 2021-03-23
- Inventor: Masafumi Saito , Yoshiyuki Izumi , Kenichiro Murata , Eishi Yoshida , Toru Eguchi
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JPJP2016-054249 20160317
- International Application: PCT/JP2017/004261 WO 20170206
- International Announcement: WO2017/159116 WO 20170921
- Main IPC: H02G1/12
- IPC: H02G1/12 ; H01R43/28 ; H02G1/00

Abstract:
A peeling device (12) includes a first peeling unit (21) and a second peeling unit (22). When an upper peeling die (33) and a lower peeling die (34) of the first peeling unit (21) are moved forward, an insulating coating (8) is peeled off from upper and lower surface of a coil conductor wire (2), and a conductive portion (7) is cut from the upper surface and the lower surface of the coil conductor wire (2). The conductive portion (7) is formed to have exposed portions (7a) and recessed portions (7b) cut in a trapezoidal shape. A front peeling die (42) and a rear peeling die (43) of the second peeling unit (22) are moved downward while the recessed portion (7b) is placed on and pressed against a second receiving section (41b) of a cradle (41), which peels off the insulating coating (8) and cuts the conductive portion (7).
Information query