Invention Grant
- Patent Title: Folded flex circuit board for camera ESD protection
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Application No.: US16122810Application Date: 2018-09-05
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Publication No.: US10958815B1Publication Date: 2021-03-23
- Inventor: Chih-Jen Chen
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kowert, Hood, Munyon, Rankin & Goetzel, P.C.
- Agent Robert Kowert
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H05K1/18 ; H05K1/02 ; G06F3/041

Abstract:
Various embodiments disclosed herein include a folded flex circuit board that may be used in a camera module. In some embodiments, the folded flex circuit board may include a base portion and one or more tab portions that extend from the base portion. In various examples, the folded flex circuit board may be folded such that the tab portion(s) form at least a portion of one or more sides of a camera module. According to some embodiments, the folded flex circuit board may be configured to provide electrostatic discharge (ESD) protection to the camera module.
Information query